- cross-posted to:
- electronics@discuss.tchncs.de
- cross-posted to:
- electronics@discuss.tchncs.de
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The amount of physical and engineering issues required to do this is insane. Veritasium just published a documentary about ASML’s chip fabs: https://youtu.be/MiUHjLxm3V0
Thats like size of 4 atoms
(Ik it doesnt refer to size of the chip but still)
Isn’t this all marketing mumbo jumbo by now?
Maybe the marketing language is technically deficient but the result of the technology speaks for itself; devices keep getting faster AND more power efficient.
Meanwhile it’s so damn hard to do that there’s only one company making the machines that can pull it off and only one company that can successfully execute the process.
This stuff is ultra pimpin no matter what the marketing department calls it.
How about building some ram into the chips?
No because apple bought up almost the entire 2026 allocation.
There are actually rumors that Apple might bake the ram into their chips directly. Of course that doesn’t mean that ram prices will go down, but it would mean ram will be built on these 2nm wafers
https://www.macrumors.com/2025/08/12/kuo-on-iphone-18-a20-chip-packaging/
A 2nm Limbo would be crazy.
Hermes can do it.
